Datasheet

DAC8531
2
SBAS192B
www.ti.com
V
DD
to GND ........................................................................... –0.3V to +6V
Digital Input Voltage to GND ................................. –0.3V to +V
DD
+ 0.3V
V
OUT
to GND .......................................................... –0.3V to +V
DD
+ 0.3V
Operating Temperature Range ......................................–40°C to +105°C
Storage Temperature Range .........................................–65°C to +150°C
Junction Temperature Range (T
J
max) ........................................ +150°C
Power Dissipation ........................................................ (T
J
max — T
A
)/ θ
JA
θ
JA
Thermal Impedance ......................................................... 206°C/W
θ
JC
Thermal Impedance .......................................................... 44°C/W
Lead Temperature, Soldering:
Vapor Phase (60s) ............................................................... +215°C
Infrared (15s) ........................................................................ +220°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS
(1)
PACKAGE/ORDERING INFORMATION
MINIMUM
RELATIVE DIFFERENTIAL SPECIFICATION
ACCURACY NONLINEARITY PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT (LSB) (LSB) PACKAGE-LEAD DESIGNATOR
(1)
RANGE MARKING NUMBER MEDIA, QUANTITY
DAC8531E ±64 ±1 MSOP-8 DGK –40°C to +105°C D31 DAC8531E/250 Tape and Reel, 250
""" " " ""DAC8531E/2K5 Tape and Reel, 2500
DAC8531I ±64 ±1 SON-8 DRB –40°C to +105°C D31 DAC8531IDRBT Tape and Reel, 250
DAC8531I
"" " " ""DAC8531IDRBR Tape and Reel, 2500
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
PARAMETER CONDITIONS MIN TYP MAX UNITS
STATIC PERFORMANCE
(1)
Resolution 16 Bits
Relative Accuracy ±0.098 % of FSR
Differential Nonlinearity Ensured Monotonic by Design ±1LSB
Zero Code Error All Zeroes Loaded to DAC Register +5 +20 mV
Full-Scale Error All Ones Loaded to DAC Register –0.15 –1.25 % of FSR
Gain Error ±1.25 % of FSR
Zero Code Error Drift ±20 µV/°C
Gain Temperature Coefficient ±5 ppm of FSR/°C
OUTPUT CHARACTERISTICS
(2)
Output Voltage Range 0V
REF
V
Output Voltage Settling Time To ±0.003% FSR
0200
H
to FD00
H
810 µs
R
L
= 2kΩ; 0pF < C
L
< 200pF
R
L
= 2kΩ; C
L
= 500pF 12 µs
Slew Rate 1V/µs
Capacitive Load Stability R
L
= ∞ 470 pF
R
L
= 2kΩ 1000 pF
Code Change Glitch Impulse 1LSB Change Around Major Carry 20 nV-s
Digital Feedthrough 0.5 nV-s
DC Output Impedance 1 Ω
Short-Circuit Current V
DD
= +5V 50 mA
V
DD
= +3V 20 mA
Power-Up Time Coming Out of Power-Down Mode
V
DD
= +5V 2.5 µs
Coming Out of Power-Down Mode
V
DD
= +3V 5 µs
REFERENCE INPUT
Reference Current V
REF
= V
DD
= +5V 35 45 µA
V
REF
= V
DD
= +3.6V 20 30 µA
Reference Input Range 0 V
DD
V
Reference Input Impedance 150 kΩ
ELECTRICAL CHARACTERISTICS
V
DD
= +2.7V to +5.5V. –40°C to +105°C, unless otherwise specified.
DAC8531E
NOTES: (1) Linearity calculated using a reduced code range of 485 to 64714; output unloaded. (2) Ensured by design and characterization, not production tested.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.