Datasheet
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
D0
NC
NC
NC
V -4
REF-B
V -5
AV
AGND-B
V -6
AV
OFFSET-B
V -7
NC
RSTSEL
GPIO
OUT
OUT
DD
OUT
SS
OUT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
D11
D12
D13
V
V -3
REF-A
V -2
AV
AGND-A
V -1
AV
OFFSET-A
V -0
NC
/BTCUSB
BUSY
MON
OUT
OUT
DD
OUT
SS
OUT
D10
D9
D8
D7
D6
D5
R/
DV
IOV
DGND
NC
D4
D3
D2
D1
CS
W
DD
DD
CLR
LDAC
RST
A0
A1
NC
NC
DV
DGND
A2
A3
NC
A4
DGND
NC
NC
DD
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
DAC8228
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
D11
D12
D13
V
V -3
REF-A
V -2
AV
AGND-A
V -1
AV
OFFSET-A
V -0
/BTCUSB
MON
OUT
OUT
DD
OUT
SS
OUT
D1
D0
NC
NC
NC
V -4
REF-B
V -5
AV
AGND-B
V -6
AV
OFFSET-B
V -7
OUT
DD
SS
OUT
OUT
OUT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
42
41
40
39
38
37
36
35
34
33
32
31
30
29
DAC8228
D10
D9
D8
D7
D6
D5
R/
DV
IOV
DGND
D4
D3
D2
CS
W
DD
DD
BUSY
CLR
LDAC
RST
A0
A1
DV
DGND
A2
A3
A4
DGND
GPIO
RSTSEL
DD
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
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43
DAC8228
SBAS462A –JUNE 2009–REVISED NOVEMBER 2009
www.ti.com
PIN CONFIGURATIONS
PAG PACKAGE
RTQ PACKAGE
TQFP-64
QFN-56
(TOP VIEW)
(TOP VIEW)
(1) The thermal pad is internally connected to
the substrate. This pad can be connected
to AV
SS
or left floating. Keep the thermal
pad separate from the digital ground, if
possible.
PIN DESCRIPTIONS
PIN NO.
PIN
NAME
QFN-56 TQFP-64 I/O DESCRIPTION
D11 1 1 I/O Data bit 11
D12 2 2 I/O Data bit 12
D13 3 3 I/O Data bit 13
Analog monitor output. This pin is either in Hi-Z status, or connected to one of the DAC outputs,
V
MON
4 4 O
reference buffer outputs, or offset DAC outputs, depending on the content of the Monitor Register.
V
OUT
-3 5 5 O DAC-3 output
REF-A 6 6 I Group A
(1)
reference input
V
OUT
-2 7 7 O DAC-2 output
AV
DD
8 8 I Positive analog power supply
AGND-A 9 9 I Group A
(1)
analog ground and the ground of REF-A. This pin must be tied to AGND-B and DGND.
V
OUT
-1 10 10 O DAC-1 output
AV
SS
11 11 I Negative analog power supply. Connect to AGND in single-supply operation.
OFFSET DAC-A analog output. Must be connected to AGND-A during single power-supply operation
OFFSET-A 12 12 O
(AV
SS
= 0V). This pin is not intended to drive an external load.
V
OUT
-0 13 13 O DAC-0 output
Input data format selection. Input data are in straight binary format when connected to DGND or in
USB/BTC 14 15 I twos complement format when connected to IOV
DD
. Command data are always in straight binary
format.
This pin is an open drain and requires an external pullup resistor. BUSY goes low when the correction
BUSY 15 16 O
engine is running; see the Busy Pin section for details.
Level trigger. When the CLR pin is logic '0', all V
OUT
-X pins connect to AGND-x through switches and
CLR 16 17 I an internal 15kΩ resistor. When the CLR pin is logic '1' and LDAC is logic '0', all V
OUT
-X pins connect
to the amplifier outputs.
(1) Group A consists of DAC-0, DAC-1, DAC-2, and DAC-3. Group B consists of DAC-4, DAC-5, DAC-6, and DAC-7.
10 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8228