Datasheet

2.2 Bill of Materials
PCB Design www.ti.com
Figure 8. Drill Drawing
Table 1. Parts List
Item Qty. Value Designators Description Vendor Vendor Part No.
1 7 10k Ω R1–R4, R–R9 1/10W 0603 Thick Film Chip Resistor, ± 1% Tol Panasonic ERJ-3EKF1002V
2 1 20k Ω Trim Pot R10 5T Potentiometer, 4mm SMD, Cermet Bourns 3214W-1-203E
3 4 0 Ω R11–R14 1/16W 0603 Thick Film Chip Resistor, ± 1% Tol Panasonic ERJ-3EKF0R00V
4 1 100k Ω Trim Pot R15 Potentiometer, 4mm SMD, Cermet Bourns 3214W-1-104E
5 1 20K Ω R16 1/10W 0603 Thick Film Chip Resistor, ± 1% Tol Panasonic ERJ-3EKF2002V
6 1 100 Ω R24 W 1206 Thick Film Chip Resistor, ± 5% Tol Panasonic ERJ-8GEYJ101V
7 3 10F C1–C3 Multilayer Ceramic Chip Capacitor, 1206 SMD, TDK C3216X7R1C106M
16V, ± 15% TC, ± 20% Tol
8 4 0.1 µ F C4–C7 Multilayer Ceramic Chip Capacitor, 0603 SMD, TDK C1608X7R1E104K
25V, ± 15% TC, ± 10% Tol
9 2 1 µ F C10, C11 Multilayer Ceramic Chip Capacitor, 0805 SMD, TDK C2012X7R1E105K
25V, ± 15% TC, ± 10% Tol
10 1 1nF C12 Multilayer Ceramic Chip Capacitor, 0603 SMD, TDK C1608COG1H102J
50V, ± 15% TC, ± 5% Tol
11 1 100pF C13 Multilayer Ceramic Chip Capacitor, 0603 SMD, TDK C1608COG1H101J
50V, 30ppm/ ° C, ± 5% Tol
12 11 14-Bit String DAC U1 TSSOP-16(PW), 4-CH, SPI, Low Glitch, Voltage Texas Instruments DAC8164IDPW
Output DAC with Internal reference
DAC8165IDPW
13 1 Difet Operational U2 8-SOP(D) Precision High-Speed, Difet Texas Instruments OPA627AU
Amplifier Operational Amplifier
14 1 5V Reference U3 15ppm/ ° C, ± 0.2% Tol Output, SOIC-8, Voltage Texas Instruments REF02AU
Reference
15 1 FET Input U4 8-SOIC(D) High Speed Low Noise Operational Texas Instruments OPA2132UA
Operational Amplifier
Amplifier
16 2 10 × 2 × 0.1 SMT J2A J4A 20-Pin Terminal Strip Samtec TSM-110-01-S-DV-M
17 1 5 × 2 × 0.1 SMT J3A 10-Pin Terminal Strip Samtec TSM-105-01-T-DV
18 2 10 × 2 × 0.1 SMT J2B, J4B 20-Pin Socket Strip
(1)
Samtec SSW-110-22-S-D-VS-P
19 1 5 × 2 × 0.1 SMT J3B 10-Pin Socket Strip
(1)
Samtec SSW-105-22-F-D-VS-K
(1)
J2B, J3B and J4B parts are not shown in the schematic diagram. All the JxB designated parts are installed in the bottom side of the
PCB opposite the JxA designated counterpart. Example, J2A is installed on the topside while J2B is installed in the bottom side opposite
of J2A. Do NOT install the following: C8 C9 C14 R5 R6 R17 R18 R19 R20 R21 R22 R23 R25.
8 DAC8164/65 Evaluation Module SLAU256 – August 2008
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