Datasheet
DAC7678
SBAS493B –FEBRUARY 2010–REVISED JULY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
MAXIMUM MAXIMUM MAXIMUM SPECIFIED
PACKAGE- PACKAGE PACKAGE
PRODUCT RELATIVE DIFFERENTIAL REFERENCE DRIFT TEMPERATURE
LEAD DESIGNATOR MARKING
ACCURACY (LSB) NONLINEARITY (LSB) (ppm/°C) RANGE
TSSOP-16 PW
DAC7678 ±1 ±0.25 25 –40°C to +125°C DAC7678
QFN-24 RGE
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
DAC7678 UNIT
AV
DD
to GND –0.3 to +6 V
Digital input voltage to GND –0.3 to +AV
DD
+ 0.3 V
V
OUT
to GND –0.3 to +AV
DD
+ 0.3 V
V
REFIN
/V
REFOUT
to GND –0.3 to +AV
DD
+ 0.3 V
Operating temperature range –40 to +125 °C
Storage temperature range –65 to +150 °C
Junction temperature range (T
J
max) +150 °C
Power dissipation (T
J
max – T
A
)/θ
JA
W
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
THERMAL INFORMATION
DAC7678
THERMAL METRIC
(1)
UNITS
PW (16 PINS) RGE (24 PINS)
θ
JA
Junction-to-ambient thermal resistance 111.9 33.7
θ
JCtop
Junction-to-case (top) thermal resistance 33.3 16.9
θ
JB
Junction-to-board thermal resistance 52.4 7.4
°C/W
ψ
JT
Junction-to-top characterization parameter 2 0.5
ψ
JB
Junction-to-board characterization parameter 51.2 7.1
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a 1.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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