Datasheet

4
®
DAC7644
LINEARITY DIFFERENTIAL PACKAGE SPECIFICATION
ERROR NONLINEARITY DRAWING TEMPERATURE ORDERING TRANSPORT
PRODUCT (LSB) (LSB) PACKAGE NUMBER
(1)
RANGE NUMBER
(2)
MEDIA
DAC7644E ±4 ±3 48-Lead SSOP 333 –40°C to +85°C DAC7644E Rails
"" """ "DAC7644E/1K Tape and Reel
DAC7644EB ±3 ±2 48-Lead SSOP 333 –40°C to +85°C DAC7644EB Rails
"" """ "DAC7644EB/1K Tape and Reel
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/)
are available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces of “DAC7644/1K” will get a single
1000-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.
ABSOLUTE MAXIMUM RATINGS
(1)
V
CC
and V
DD
to V
SS
.............................................................. –0.3V to 11V
V
CC
and V
DD
to GND ........................................................... –0.3V to 5.5V
V
REF
L to V
SS
............................................................. –0.3V to (V
CC
– V
SS
)
V
CC
to V
REF
H ............................................................ –0.3V to (V
CC
– V
SS
)
V
REF
H to V
REF
L ......................................................... –0.3V to (V
CC
– V
SS
)
Digital Input Voltage to GND ................................... –0.3V to V
DD
+ 0.3V
Digital Output Voltage to GND ................................. –0.3V to V
DD
+ 0.3V
Maximum Junction Temperature ................................................... +150°C
Operating Temperature Range ........................................–40°C to +85°C
Storage Temperature Range ......................................... –65°C to +125°C
Lead Temperature (soldering, 10s) ............................................... +300°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION