Datasheet
www.ti.com
3
A3
A2
A1
1
2
3
4
5
6
7
8
16
15
14
1
12
11
10
9
V
OUT
A
V
OUT
B
V
REF
H
V
DD
V
REF
L
GND
V
OUT
C
V
OUT
D
A0
IOV
DD
SDA
SCL
LDAC
DAC7573
ABSOLUTE MAXIMUM RATINGS
(1)
DAC7573
SLAS398 – SEPTEMBER 2003
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT PACKAGE PACKAGE SPECIFICATION PACKAGE ORDERING TRANSPORT MEDIA
DRAWING TEMPERATURE MARKING NUMBER
NUMBER RANGE
DAC7573 16-TSSOP PW –40 °C TO +105 °C D7573I DAC7573IPW 90 Piece Tube
DAC7573IPWR 2000 Piece Tape and Reel
PW PACKAGE
PIN DESCRIPTIONS
(TOPVIEW)
PIN NAME DESCRIPTION
1 V
OUT
A Analog output voltage from DAC A
2 V
OUT
B Analog output voltage from DAC B
3 V
REF
H Positive reference voltage input
4 V
DD
Analog voltage supply input
5 V
REF
L Negative reference voltage input
Ground reference point for all circuitry on the
6 GND
part
7 V
OUT
C Analog output voltage from DAC C
8 V
OUT
D Analog output voltage from DAC D
9 LDAC H/W synchronous V
OUT
update
10 SCL Serial clock input
11 SDA Serial data input
12 IOV
DD
I/O voltage supply input
13 A0 Device address select - I
2
C
14 A1 Device address select - I
2
C
15 A2 Device address select - Extended
16 A3 Device address select - Extended
V
DD
to GND –0.3 V to +6 V
Digital input voltage to GND –0.3 V to V
DD
+ 0.3 V
V
OUT
to GND –0.3 V to V
DD
+ 0.3 V
Operating temperature range –40 °C to +105 °C
Storage temperature range –65 °C to +150 °C
Junction temperature range (T
J
max) +150 °C
Power dissipation: Thermal impedance ( ΘJA) 161 °C/W
Thermal impedance ( ΘJC) 29 °C/W
Lead temperature, soldering: Vapor phase (60s) 215 °C
Infrared (15s) 220 °C
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2