Datasheet

DAC7551-Q1
SLAS767 –JUNE 2011 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE TEMPERATURE PACKAGE
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING
DAC7551-Q1 SON-12 DRN –40°C to +105°C RAN
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
UNIT
V
DD
, IOV
DD
to GND –0.3V to 6V
Digital input voltage to GND –0.3V to V
DD
+ 0.3V
V
OUT
to GND –0.3V to V
DD
+ 0.3V
Operating temperature range –40°C to +105°C
Storage temperature range –65°C to +150°C
Junction temperature (T
J
Max) +150°C
Power dissipation (DRN) (T
J
max – T
A
)/θ
JA
Thermal impedance, θ
JA
79°C/W
Thermal impedance, θ
JC
48.57°C/W
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2 Copyright © 2011, Texas Instruments Incorporated