Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsData collecting ICsData acquisition IC - DA converter (DAC) USON 12

Interface

Logic

Shift

DAC

String

DAC

Power-Down

Logic

Power-On

Reset

IOV

REF

OUT

REF

LGNDCLR

SDO

SDIN

SYNC

SCLK

DAC7551-Q1

www.ti.com

SLAS767 –JUNE 2011

12-Bit, Ultra-Low Glitch, Voltage Output

DIGITAL-TO-ANALOG CONVERTER

Check for Samples: DAC7551-Q1

FEATURES

DESCRIPTION

The DAC7551-Q1 is a single-channel, voltage-output

234

• Qualified for Automotive Applications

digital-to-analog converter (DAC) with exceptional

• Relative Accuracy (INL): ±0.35LSB

linearity and monotonicity, and a proprietary

• Ultra-Low Glitch Energy: 0.1nV-s

architecture that minimizes glitch energy. The

• Low Power Operation: 100μA at 2.7V

low-power DAC7551-Q1 operates from a single 2.7V

to 5.5V supply. The DAC7551-Q1 output amplifiers

• Power-On Reset to Zero Scale

can drive a 2kΩ, 200pF load rail-to-rail with 5μs

• Power Supply: 2.7V to 5.5V Single Supply

settling time; the output range is set using an external

• Power-Down: 0.05μA at 2.7V

voltage reference.

• 12-Bit Linearity and Monotonicity

The 3-wire serial interface operates at clock rates up

• Rail-to-Rail Voltage Output

to 50MHz and is compatible with SPI™, QSPI™,

• Settling Time: 5μs (Max)

Microwire™, and DSP interface standards. The parts

• SPI-Compatible Serial Interface with

incorporate a power-on-reset circuit to ensure that the

Schmitt-Trigger Input: Up to 50MHz

DAC output powers up to 0V and remains there until

a valid write cycle to the device takes place. The part

• Daisy-Chain Capability

contains a power-down feature that reduces the

• Asynchronous Hardware Clear to Zero Scale

current consumption of the device to under 2μA.

• Specified Temperature Range:

–40°C to +105°C

Small size and low-power operation make the

DAC7551-Q1 ideally suited for battery-operated,

• Small, 2 x 3 mm, 12-Lead SON Package

portable applications. The power consumption is

typically 0.5mW at 5V, 0.23mW at 3V, and reduces to

APPLICATIONS

1μW in power-down mode.

• Portable, Battery-Powered Instruments

The DAC7551-Q1 is available in a 12-lead SON

• Digital Gain and Offset Adjustment

package and is specified over –40°C to +105°C.

• Programmable Voltage and Current Sources

• Programmable Attenuators

• Industrial Process Control

FUNCTIONAL BLOCK DIAGRAM

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2SPI, QSPI are trademarks of Motorola, Inc.

3Microwire is a trademark of National Semiconductor Corp..

4All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (23 pages)

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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com 12-Bit, Ultra-Low Glitch, Voltage Output DIGITAL-TO-ANALOG CONVERTER Check for Samples: DAC7551-Q1 FEATURES DESCRIPTION • • • • • • • • • • • The DAC7551-Q1 is a single-channel, voltage-output digital-to-analog converter (DAC) with exceptional linearity and monotonicity, and a proprietary architecture that minimizes glitch energy. The low-power DAC7551-Q1 operates from a single 2.7V to 5.5V supply.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS all specifications at –40°C to +105°C, VDD = 2.7V to 5.5V, VREFH = VDD, VREFL = GND, RL = 2kΩ to GND, and CL = 200pF to GND (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNITS ±0.35 ±1 LSB ±0.08 ±0.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) all specifications at –40°C to +105°C, VDD = 2.7V to 5.5V, VREFH = VDD, VREFL = GND, RL = 2kΩ to GND, and CL = 200pF to GND (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNITS POWER REQUIREMENTS VDD IOVDD IDD (3) (4) Normal operation (DAC active and excluding load current) All power-down modes 2.7 5.5 V 1.8 VDD V VDD = 3.6V to 5.5V, VIH = IOVDD, VIL = GND 150 200 VDD = 2.7V to 3.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com PIN CONFIGURATION VDD 1 12 IOVDD VREFH 2 11 SDO VREFL 3 10 SDIN 9 SCLK 8 SYNC 7 CLR DAC7751 VFB 4 VOUT 5 GND 6 Thermal Pad(1) Pin Descriptions PIN NO. (1) NAME DESCRIPTION 1 VDD Analog voltage supply input 2 VREFH Positive reference voltage input 3 VREFL Negative reference voltage input 4 VFB DAC amplifier sense input. 5 VOUT Analog output voltage from DAC 6 GND (1) Ground.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com SERIAL WRITE OPERATION t1 SCLK t8 t2 t3 t4 t7 SYNC t5 SDIN t6 D15 D14 D13 D12 D11 D1 D0 Input Word n D15 D0 t9 SDO Input Word n+1 D15 D0 D14 Input Word n Undefined t10 CLR Figure 1. Serial Write Operation Timing Diagram TIMING CHARACTERISTICS (1) (2) All specifications at –40°C to +105°C, VDD = 2.7V to 5.5V, and RL = 2kΩ to GND (unless otherwise noted).
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C, unless otherwise noted. LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE 1.0 VDD = 5V, VREFH = 4.096V, VREFL = GND 0.5 LE (LSB) LE (LSB) 1.0 0 0 -0.5 -1.0 -1.0 0.50 0.50 0.25 0.25 DLE (LSB) DLE (LSB) -0.5 VDD = 2.7V, VREFH = 2.5V, VREFL = GND 0.5 0 -0.25 -0.50 0 -0.25 -0.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, unless otherwise noted. FULL-SCALE ERROR vs FREE-AIR TEMPERATURE FULL-SCALE ERROR vs FREE-AIR TEMPERATURE 0 0 Full-Scale Error (mV) Full-Scale Error (mV) VDD = 2.7V VREFH = 2.5V VREFL = GND -0.25 -0.50 -0.75 VDD = 5V VREFH = 4.096V VREFL = GND -1.00 -0.25 -0.50 -0.75 -1.00 -40 20 -10 50 80 105 -40 20 -10 Free-Air Temperature (°C) 50 80 105 Free-Air Temperature (°C) Figure 6. Figure 7.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, unless otherwise noted. SUPPLY CURRENT vs FREE-AIR TEMPERATURE 200 110 VDD = 5.5V VREFH = 4.096V VREFL = GND 150 VDD = 2.7V VREFH = 2.5V VREFL = GND 125 DAC Powered, No Load VREFH = 2.5V VREFL = GND 105 IDD (mA) 175 IDD (mA) SUPPLY CURRENT vs SUPPLY VOLTAGE 100 95 Powered, No Load 100 90 -40 -10 20 50 80 110 3.1 2.7 3.5 Free-Air Temperature (°C) 5.1 5.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, unless otherwise noted. TOTAL ERROR - 2.7V EXITING POWER-DOWN MODE 5 4 VDD = 2.7V VREFH = 2.5V VREFL = GND TA = +25°C 4 Output Voltage (V) Total Error (mV) 2 0 -2 VDD = 5V VREFH = 4.096V VREFL = GND Power-Up Code = 4000 3 2 1 0 -4 0 512 1024 1536 2048 2560 3072 3584 Time (4ms/div) 4096 Digital Input Code Figure 18. Figure 19.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, unless otherwise noted. TOTAL HARMONIC DISTORTION vs OUTPUT FREQUENCY DIGITAL FEEDTHROUGH ERROR -40 VDD = 5.5V VREFH = 4.096V VREFL = GND fS = 1MSPS -1dB FSR Digital Input Measurement Bandwidth = 20kHz VO (5mV/div) -50 THD (dB) -60 -70 THD -80 2nd Harmonic -90 3rd Harmonic Trigger Pulse Time (400ns/div) Figure 24.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com THEORY OF OPERATION DIGITAL-TO-ANALOG CONVERTER VREFH The architecture of the DAC7551-Q1 consists of a string DAC followed by an output buffer amplifier. Figure 26 shows a generalized block diagram of the DAC architecture. VREFH 100kW 100kW RDIVIDER VREFH - VREFL 2 R VFB 50kW DAC Register REF(+) Resistor String REF(-) VOUT R To Output Amplifier (2x Gain) VREFL Figure 26.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com OUTPUT BUFFER AMPLIFIERS Power-On Reset The output buffer amplifier is capable of generating rail-to-rail voltages on its output, giving an output range of 0V to VDD. It is capable of driving a load of 2kΩ in parallel with up to 1000pF to GND. The source and sink capabilities of the output amplifier can be seen in the typical curves. The slew rate is 1.8V/μs with a half-scale settling time of 3μs with the output unloaded.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com SERIAL INTERFACE The DAC7551-Q1 is controlled over a versatile 3-wire serial interface, which operates at clock rates up to 50MHz and is compatible with SPI, QSPI, Microwire, and DSP interface standards. 16-Bit Word and Input Shift Register The input shift register is 16 bits wide. DAC data are loaded into the device as a 16-bit word under the control of a serial clock input, SCLK, as shown in Figure 1, the Serial Write Operation timing diagram.
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DAC7551-Q1 SLAS767 – JUNE 2011 www.ti.com APPLICATION INFORMATION WAVEFORM GENERATION As a result of the exceptional linearity and low glitch of the DAC7551-Q1, the device is well-suited for waveform generation (from DC to 10kHz). The DAC7551-Q1 large-signal settling time is 5μs, supporting an update rate of 200kSPS. However, the update rates can exceed 1MSPS if the waveform to be generated consists of small voltage steps between consecutive DAC updates. To obtain a high dynamic range, REF3140 (4.
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PACKAGE OPTION ADDENDUM www.ti.com 26-Feb-2013 PACKAGING INFORMATION Orderable Device Status (1) DAC7551TDRNRQ1 ACTIVE Package Type Package Pins Package Qty Drawing USON DRN 12 3000 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) CU NIPDAU Level-2-260C-1 YEAR (4) -40 to 105 RAN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Feb-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DAC7551TDRNRQ1 Package Package Pins Type Drawing USON DRN 12 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 330.0 12.4 Pack Materials-Page 1 2.3 B0 (mm) K0 (mm) P1 (mm) 3.3 0.85 4.0 W Pin1 (mm) Quadrant 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Feb-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC7551TDRNRQ1 USON DRN 12 3000 338.1 338.1 20.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.