Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- THERMAL INFORMATION
- ELECTRICAL CHARACTERISTICS
- PIN CONFIGURATIONS
- TIMING DIAGRAM
- TIMING REQUIREMENTS
- TYPICAL CHARACTERISTICS: DAC at AVDD = 5.5 V
- TYPICAL CHARACTERISTICS: DAC AT AVDD = 3.6 V
- TYPICAL CHARACTERISTICS: DAC AT AVDD = 2.7 V
- THEORY OF OPERATION
- DIGITAL-TO-ANALOG CONVERTER (DAC)
- RESISTOR STRING
- OUTPUT AMPLIFIER
- TWO-WIRE, I2C-COMPATIBLE INTERFACE
- DACx578 I2C UPDATE SEQUENCE
- POWER-ON RESET TO ZERO-SCALE OR MIDSCALE
- LDAC FUNCTIONALITY
- POWER-DOWN COMMANDS
- CLEAR CODE REGISTER AND CLR PIN
- SOFTWARE RESET FUNCTION
- OPERATING EXAMPLES: DAC7578
- Example 1: Write Mid Scale to Data Buffer A and Update Channel A Output
- Example 2: Power-Down Channel B, C, and H with Hi-Z Output
- Example 3: Read-back the value of the input register of DAC Channel G
- Example 4: Write multiple bytes of data to Channel F. Write Full Scale and then Quarter Scale to Channel F
- Example 5: Write Mid Scale and then Full Scale to all DAC channels.
- APPLICATION INFORMATION
- PARAMETER DEFINITIONS
- Revision History
PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2010
Addendum-Page 2
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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