Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- THERMAL INFORMATION
- ELECTRICAL CHARACTERISTICS
- PIN CONFIGURATIONS
- TIMING DIAGRAM
- TIMING REQUIREMENTS
- TYPICAL CHARACTERISTICS: DAC at AVDD = 5.5 V
- TYPICAL CHARACTERISTICS: DAC AT AVDD = 3.6 V
- TYPICAL CHARACTERISTICS: DAC AT AVDD = 2.7 V
- THEORY OF OPERATION
- DIGITAL-TO-ANALOG CONVERTER (DAC)
- RESISTOR STRING
- OUTPUT AMPLIFIER
- TWO-WIRE, I2C-COMPATIBLE INTERFACE
- DACx578 I2C UPDATE SEQUENCE
- POWER-ON RESET TO ZERO-SCALE OR MIDSCALE
- LDAC FUNCTIONALITY
- POWER-DOWN COMMANDS
- CLEAR CODE REGISTER AND CLR PIN
- SOFTWARE RESET FUNCTION
- OPERATING EXAMPLES: DAC7578
- Example 1: Write Mid Scale to Data Buffer A and Update Channel A Output
- Example 2: Power-Down Channel B, C, and H with Hi-Z Output
- Example 3: Read-back the value of the input register of DAC Channel G
- Example 4: Write multiple bytes of data to Channel F. Write Full Scale and then Quarter Scale to Channel F
- Example 5: Write Mid Scale and then Full Scale to all DAC channels.
- APPLICATION INFORMATION
- PARAMETER DEFINITIONS
- Revision History
DAC5578
DAC6578
DAC7578
SBAS496A –MARCH 2010–REVISED AUGUST 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
MAXIMUM
MAXIMUM RELATIVE SPECIFIED
DIFFERENTIAL PACKAGE- PACKAGE PACKAGE
PRODUCT ACCURACY TEMPERATURE
NONLINEARITY LEAD DESIGNATOR MARKING
(LSB) RANGE
(LSB)
TSSOP-16 PW DAC7578
DAC7578 ±1 ±0.25 –40°C to +125°C
QFN-24 RGE DAC7578
TSSOP-16 PW DAC6578
DAC6578 ±0.5 ±0.5 –40°C to +125°C
QFN-24 RGE DAC6578
TSSOP-16 PW DAC5578
DAC5578 ±0.25 ±0.25 –40°C to +125°C
QFN-24 RGE DAC5578
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
DAC5578, DAC6578, DAC7578 UNIT
AV
DD
to GND –0.3 to +6 V
Digital input voltage to GND –0.3 to +AV
DD
+ 0.3 V
V
OUT
to GND –0.3 to +AV
DD
+ 0.3 V
V
REFIN
to GND –0.3 to +AV
DD
+ 0.3 V
Operating temperature range –40 to +125 °C
Storage temperature range –65 to +150 °C
Junction temperature range (T
J
max) +150 °C
Power dissipation (T
J
max – T
A
)/q
JA
W
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
THERMAL INFORMATION
DACx578
THERMAL METRIC
(1)
UNITS
PW (16 Pins) RGE (24 PINS)
q
JA
Junction-to-ambient thermal resistance 111.9 33.7
q
JCtop
Junction-to-case (top) thermal resistance 33.3 16.9
q
JB
Junction-to-board thermal resistance 52.4 7.4
°C/W
y
JT
Junction-to-top characterization parameter 2 0.5
y
JB
Junction-to-board characterization parameter 51.2 7.1
q
JCbot
Junction-to-case (bottom) thermal resistance n/a 1.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): DAC5578 DAC6578 DAC7578