Datasheet
www.ti.com
A1
A0
1
2
3
4
5 6
7
8
10
9
V
OUT
A
V
OUT
B
GND
V
OUT
C
V
OUT
D
V
DD
SDA
SCL
DAC6574
.
ABSOLUTE MAXIMUM RATINGS
(1)
DAC6574
SLAS408 – DECEMBER 2003
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT PACKAGE PACKAGE SPECIFICATION PACKAGE ORDERING TRANSPORT MEDIA
DRAWING TEMPERATURE MARKING NUMBER
NUMBER RANGE
DAC6574 10-MSOP DGS –40 °C TO +105 °C D674 DAC6574IDGS 80 Piece Tube
DAC6574IDGSR 2500 Piece Tape and Reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
DGS PACKAGE
PIN DESCRIPTIONS
(TOPVIEW)
PIN NAME DESCRIPTION
1 V
OUT
A Analog output voltage from DAC A
2 V
OUT
B Analog output voltage from DAC B
Ground reference point for all circuitry on the
3 GND
part
4 V
OUT
C Analog output voltage from DAC C
5 V
OUT
D Analog output voltage from DAC D
6 SCL Serial clock input
7 SDA Serial data input and output
8 V
DD
Analog voltage supply input
9 A0 Device address select - I
2
C
10 A1 Device address select - I
2
C
V
DD
to GND –0.3 V to +6 V
Digital input voltage to GND –0.3 V to V
DD
+ 0.3 V
V
OUT
to GND –0.3 V to V
DD
+ 0.3 V
Operating temperature range –40 °C to +105 °C
Storage temperature range –65 °C to +150 °C
Junction temperature range (T
J
max) +150 °C
Power dissipation: Thermal impedance ( ΘJA) 270 °C/W
Thermal impedance ( ΘJC) 77 °C/W
Lead temperature, soldering: Vapor phase (60s) 215 °C
Infrared (15s) 220 °C
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2