Datasheet

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PIN CONFIGURATIONS
A0
SCL
SDA
6
5
4
1
2
3
V
OUT
GND
V
DD
D671
1
2
3
6
5
4
YMLL
(TOP VIEW)
(BOTTOM VIEW)
Lot Trace Code
ABSOLUTE MAXIMUM RATINGS
(1)
DAC6571
SLAS406B – DECEMBER 2003 – REVISED AUGUST 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE PACKAGE ORDERING
PRODUCT PACKAGE TEMPERATURE TRANSPORT MEDIA
DESIGNATOR MARKING NUMBER
RANGE
DAC6571IDBVT 250 Piece Small Tape and Reel
DAC6571 SOT23-6 DBV – 40 ° C to +105 ° C D671
DAC6571IDBVR 3000 Piece Tape and Reel
(1) For the most current package and ordering information see the Package Option Addendum at the end of this datasheet, or see the TI
web site at www.ti.com .
PIN DESCRIPTION (SOT23-6)
PIN NAME DESCRIPTION
1 V
OUT
Analog output voltage from DAC
Ground reference point for all
2 GND
circuitry on the part
3 V
DD
Analog Voltage Supply Input
4 SDA Serial Data Input
5 SCL Serial Clock Input
6 A0 Device Address Select
LOT Year (3 = 2003); M onth (1–9 = JAN–SEP; A =
TRACE OCT, B = NOV, C = DEC); LL — Random code
CODE: generated when assembly is requested.
UNITS
V
DD
to GND –0.3 V to +6 V
Digital input voltage to GND –0.3 V to +V
DD
+ 0.3 V
V
OUT
to GND –0.3 V to +V
DD
+ 0.3 V
Operating temperature range –40 ° C to + 105 ° C
Storage temperature range –65 ° C to + 150 ° C
Junction temperature range (T
J
max) +150 ° C
Power dissipation (T
J
max – T
A
)R
θ JA
Thermal impedance, R
θ JA
240 ° C/W
Lead temperature, soldering Vapor phase (60s) 215 ° C
Infrared (15s) 220 ° C
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2