Datasheet

DAC5688
SLLS880C –DECEMBER 2007–REVISED AUGUST 2010 www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
Supply Voltage Range DVDD
(2)
–0.5 to 2.3 V
VFUSE
(2)
–0.5 to 2.3 V
CLKVDD
(2)
–0.5 to 2.3 V
AVDD
(2)
–0.5 to 4 V
IOVDD
(2)
–0.5 to 4 V
Supply Voltage Range AVDD to DVDD –2 to 2.6 V
CLKVDD to DVDD –0.5 to 0.5 V
IOVDD to AVDD –0.5 to 0.5 V
CLK2, CLK2C
(2)
–0.5 to CLKVDD + 0.5 V
CLKO_CLK1, LOCK_CLK1C, SLEEP, TXENABLE
(2)
–0.5 to IOVDD + 0.5 V
DA[15..0] ,DB[15..0]
(2)
–0.5 to IOVDD + 0.5 V
SDO, SDIO, SCLK, SDENB, RESETB
(2)
–0.5 to IOVDD + 0.5 V
IOUTA1/B1, IOUTA2/B2
(2)
–0.5 to AVDD + 0.5 V
LPF, EXTIO, EXTLO, BIASJ
(2)
–0.5 to AVDD + 0.5 V
Peak input current (any input) 20 mA mA
Peak total input current (all inputs) –30 mA mA
Operating free-air temperature range, T
A
: DAC5688I –40 to 85 °C
Storage temperature range –65 to 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Measured with respect to GND.
THERMAL INFORMATION
DAC5688
THERMAL CONDUCTIVITY UNITS
64ld QFN
T
J
Maximum junction temperature
(1)(2)
125 °C
q
JA
Theta junction-to-ambient thermal resistance (still air) 22
Theta junction-to-ambient thermal resistance (200 lfm) 15
°C/W
y
JT
Psi junction-to-top of package characterization parameter 0.2
q
JB
Theta junction-to-board characterization parameter 3.5
(1) Air flow or heat sinking reduces q
JA
and may be required for sustained operation at 85°C under maximum operating conditions.
(2) It is strongly recommended to solder the device thermal pad to the board ground plane.
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