Datasheet
www.ti.com
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
(1)
DAC5687
SLWS164E – FEBRUARY 2005 – REVISED SEPTEMBER 2006
TERMINAL FUNCTIONS (continued)
TERMINAL
I/O DESCRIPTION
NAME NO.
SLEEP 96 I Asynchronous hardware power-down input. Active-High. Internal pulldown.
TXENABLE has two purposes. In all modes, TXENABLE must be high for the DATA to the DAC to
be enabled. When TXENABLE is low, the digital logic section is forced to all 0, and any input data
presented to DA[15:0] and DB[15:0] is ignored. In interleaved data mode, when the qflag register
TXENABLE 33 I
bit is cleared, TXENABLE is used to synchronizes the data to channels A and B. The first data
after the rising edge of TXENABLE is treated as A data, while the next data is treated as B data,
and so on.
TESTMODE 97 I TESTMODE is DGND for the user
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
AVDD
(2)
– 0.5 V to 4 V
DVDD
(3)
– 0.5 V to 2.3 V
Supply voltage range CLKVDD
(2)
– 0.5 V to 4 V
IOVDD
(2)
– 0.5 V to 4 V
PLLVDD
(2)
– 0.5 V to 4 V
Voltage between AGND, DGND, CLKGND, PLLGND, and IOGND – 0.5 V to 0.5 V
AVDD to DVDD – 0.5 V to 2.6 V
DA[15:0]
(4)
– 0.5 V to IOVDD + 0.5 V
DB[15:0]
(4)
– 0.5 V to IOVDD + 0.5 V
SLEEP
(4)
– 0.5 V to IOVDD + 0.5 V
CLK1/2, CLK1/2C
(3)
– 0.5 V to CLKVDD + 0.5 V
Supply voltage range
RESETB
(4)
– 0.5 V to IOVDD + 0.5 V
LPF
(4)
– 0.5 V to PLLVDD + 0.5 V
IOUT1, IOUT2
(2)
– 1 V to AVDD + 0.5 V
EXTIO, BIASJ
(2)
– 0.5 V to AVDD + 0.5 V
EXTLO
(2)
– 0.5 V to IAVDD + 0.5 V
Peak input current (any input) 20 mA
Peak total input current (all inputs) 30 mA
T
A
Operating free-air temperature range (DAC5687I) – 40 ° C to 85 ° C
T
stg
Storage temperature range – 65 ° C to 150 ° C
Lead temperature 1,6 mm (1/16 inch) from the case for 10 seconds 260 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Measured with respect to AGND.
(3) Measured with respect to DGND.
(4) Measured with respect to IOGND.
over operating free-air temperature range (unless otherwise noted)
Thermal Conductivity 100 HTQFP UNIT
T
J
Junction temperature
(2)
105 ° C
Theta junction-to-ambient (still air) 19.88 ° C/W
θ
JA
Theta junction-to-ambient (150 lfm) (0.762 m/s) 14.37 ° C/W
(1) Air flow or heat sinking reduces θ
JA
and is highly recommended.
(2) Air flow or heat sinking required for sustained operation at 85 ° C and maximum operating conditions to maintain junction temperature.
Copyright © 2005 – 2006, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): DAC5687