Datasheet

ABSOLUTE MAXIMUM RATINGS
DAC5662
www.ti.com
................................................................................................................................................................ SLAS425B JULY 2004 REVISED MAY 2007
TERMINAL FUNCTIONS (continued)
TERMINAL
I/O DESCRIPTION
NAME NO.
DGND 15, 21 I Digital ground
DVDD 16, 22 I Digital supply voltage
EXTIO 43 I/O Internal reference output (bypass with 0.1 µ F to AGND) or external reference input.
GSET 42 I Gain-setting mode: H - 1 resistor, L - 2 resistors. Internal pullup.
IOUTA1 46 O DACA current output. Full-scale with all bits of DA high.
IOUTA2 45 O DACA complementary current output. Full-scale with all bits of DA low.
IOUTB1 39 O DACB current output. Full-scale with all bits of DB high.
IOUTB2 40 O DACB complementary current output. Full-scale with all bits of DB low.
MODE 48 I Mode Select: H Dual Bus, L Interleaved. Internal pullup.
13, 14, 35,
NC - No connection
36
Sleep function control input: H DAC in power-down mode, L DAC in operating mode. Internal
SLEEP 37 I
pulldown.
WRTA/WRTIQ 17 I Input write signal for PORT A (WRTIQ in interleaving mode).
WRTB/SELEC
20 I Input write signal for PORT B (SELECTIQ in interleaving mode).
TIQ
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
AVDD
(2)
-0.5 V to 4 V
Supply voltage range
DVDD
(3)
-0.5 V to 4 V
Voltage between AGND and DGND -0.5 V to 0.5 V
Voltage between AVDD and DVDD -0.5 V to 0.5 V
DA[11:0] and DB[11:0]
(3)
-0.5 V to DVDD + 0.5 V
MODE, SLEEP, CLKA, CLKB, WRTA, WRTB
(3)
-0.5 V to DVDD + 0.5 V
Supply voltage range
IOUTA1, IOUTA2, IOUTB1, IOUTB2
(2)
-1 V to AVDD + 0.5 V
EXTIO, BIASJ_A, BIASJ_B, GSET
(2)
-0.5 V to AVDD + 0.5 V
Peak input current (any input) +20 mA
Peak total input current (all inputs) -30 mA
Operating free-air temperature range -40 ° C to 85 ° C
Storage temperature range -65 ° C to 150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Measured with respect to AGND.
(3) Measured with respect to DGND.
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