Datasheet

DAC5311
DAC6311
DAC7311
SBAS442B –AUGUST 2008–REVISED MAY 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
MAXIMUM MAXIMUM
RELATIVE DIFFERENTIAL SPECIFIED
ACCURACY NONLINEARITY PACKAGE- PACKAGE TEMPERATURE PACKAGE
PRODUCT (LSB) (LSB) LEAD DESIGNATOR RANGE MARKING
DAC5311 ±0.25 ±0.25 SC70-6 DCK –40°C to 125°C D53
DAC6311 ±0.5 ±0.5 SC70-6 DCK –40°C to 125°C D63
DAC7311 ±1 ±1 SC70-6 DCK –40°C to 125°C D73
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
PARAMETER VALUE UNIT
AV
DD
to GND –0.3 to +6 V
Digital input voltage to GND –0.3 to +AV
DD
+0.3 V
AV
OUT
to GND –0.3 to +AV
DD
+0.3 V
Operating temperature range –40 to +125 °C
Storage temperature range –65 to +150 °C
Junction temperature (T
J
max) +150 °C
Power dissipation (T
J
max – T
A
)/θ
JA
W
θ
JA
thermal impedance 250 °C/W
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
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Product Folder Links: DAC5311 DAC6311 DAC7311