Datasheet

DAC3484
www.ti.com SLAS749C –MARCH 2011–REVISED AUGUST 2012
PIN FUNCTIONS (continued)
PIN
I/O DESCRIPTION
NAME NO.
Transmit enable active high input. Internal pull-down.
To enable analog output data transmission, set sif_txenable in register config3 to “1” or pull CMOS
TXENABLE N9 I TXENABLE pin to high.
To disable analog output, set sif_txenable to “0” and pull CMOS TXENABLE pin to low. The DAC
output is forced to midscale.
TESTMODE A8 O This pin is used for factory testing. Internal pull-down. Leave unconnected for normal operation.
Digital supply voltage. This supply pin is also used for factory fuse programming. Connect to
VFUSE D7 I
DACVDD for normal operation.
ORDERING INFORMATION
(1)
T
A
ORDER CODE PACKAGE DRAWING/TYPE
(2)(3)
TRANSPORT MEDIA QUANTITY
DAC3484IRKDT 250
RKD, 88 WQFN Quad Flatpack No-Lead
DAC3484IRKDR 2000
–40°C to 85°C Tape and Reel
DAC3484IZAY 160
ZAY, 196 NFBGA
DAC3484IZAYR 1000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
(2) Thermal Pad Size: 6.4 mm x 6.4 mm
(3) MSL Peak Temperature: Level-3-260C-168 HR
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
MIN MAX
DACVDD, DIGVDD, CLKVDD –0.5 1.5 V
VFUSE –0.5 1.5 V
Supply voltage
range
(2)
IOVDD –0.5 4 V
AVDD, PLLAVDD –0.5 4 V
D[15..0]P/N, DATACLKP/N, FRAMEP/N, PARITYP/N, SYNCP/N –0.5 IOVDD + 0.5 V
DACCLKP/N, OSTRP/N –0.5 CLKVDD + 0.5 V
ALARM, SDO, SDIO, SCLK, SDENB, SLEEP, RESETB, TESTMODE,
–0.5 IOVDD + 0.5 V
TXENABLE
Pin voltage range
(2)
IOUTAP/N, IOUTBP/N, IOUTCP/N, IOUTDP/N –1.0 AVDD + 0.5 V
EXTIO, BIASJ –0.5 AVDD + 0.5 V
LPF 0.5 PLLAVDD+0.5V V
Peak input current (any input) 20 mA
Peak total input current (all inputs) –30 mA
Operating free-air temperature range, T
A
: DAC3484 –40 85 °C
Absolute maximum junction temperature, T
J
150 °C
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Measured with respect to GND.
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