Datasheet

DAC3484
SLAS749C MARCH 2011REVISED AUGUST 2012
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THERMAL INFORMATION
DAC3484
RKD ZAY
THERMAL METRIC
(1)
UNITS
PACKAGE PACKAGE
88 PINS 196 BALL
θ
JA
Junction-to-ambient thermal resistance
(2)
22.1 37.6
θ
JCtop
Junction-to-case (top) thermal resistance
(3)
7.1 6.8
θ
JCbot
Junction-to-case (bottom) thermal resistance
(4)
0.6 N/A
°C/W
θ
JB
Junction-to-board thermal resistance
(5)
4.7 16.8
ψ
JT
Junction-to-top characterization parameter
(6)
0.1 0.2
ψ
JB
Junction-to-board characterization parameter
(7)
4.6 16.4
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(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
(5) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(6) The junction-to-top characterization parameter, ψ
JT
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-board characterization parameter, ψ
JB
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
Recommended operating junction temperature 105
T
J
°C
Maximum rated operating junction temperature
(1)
125
T
A
Recommended free-air temperature –40 25 85 °C
(1) Prolonged use at this junction temperature may increase the d evice failure-in-time (FIT) rate.
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