Datasheet

DAC3152
DAC3162
SLAS736D –NOVEMBER 2010–REVISED AUGUST 2012 www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
MIN MAX
DVDD18, CLKVDD18 –0.5 2.3 V
Supply-voltage range
(2)
VFUSE –0.5 2.3 V
AVDD33 –0.5 4 V
D[11..0]P/N –0.5 DVDD18 + 0.5 V
DACCLKP/N –0.5 CLKVDD18 + 0.5 V V
Pin-voltage range
(2)
BIASJ, SLEEPB –0.5 AVDD33 + 0.7 V V
IOUTAP/N, IOUTBP/N –1 AVDD33 + 0.7 V V
Peak input current (any input) ±20 mA
Peak total input current (all inputs) ±30 mA
Operating free-air temperature range, T
A
–40 85 °C
Storage temperature range, T
stg
–65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of these or any other conditions beyond those indicated under Recommended Operating Conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Measured with respect to GND
THERMAL INFORMATION
DAC3152
DAC3162
THERMAL METRIC
(1)(2)
UNIT
RGZ (48 PINS)
θ
JA
Junction-to-ambient thermal resistance 28.9
θ
JCtop
Junction-to-case (top) thermal resistance 14.9
θ
JB
Junction-to-board thermal resistance 5.62
°C/W
ψ
JT
Junction-to-top characterization parameter 0.3
ψ
JB
Junction-to-board characterization parameter 5.6
θ
JCbot
Junction-to-case (bottom) thermal resistance 1.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
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