Datasheet

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EXAMPLE BOARD LAYOUT
( 2.6)
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
16X (0.6)
16X (0.25)
(3.8)
(3.8)
5X (
)
VIA
0.2
12X (0.5)
(0.25) TYP
(1)
(1)
4214978/A 10/2013
WQFN - 0.8 mm max heightRGH0016A
WQFN
SYMM
SEE DETAILS
1
4
5
8
9
12
13
16
SYMM
LAND PATTERN EXAMPLE
SCALE:15X
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB application report
in literature No. SLUA271 (www.ti.com/lit/slua271).
SOLDER MASK
OPENING
METAL
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)