Datasheet

DAC104S085
www.ti.com
SNAS362F MAY 2006REVISED MARCH 2013
PIN DESCRIPTIONS
SON
VSSOP Symbol Type Description
Pin No.
1 V
A
Supply Power supply input. Must be decoupled to GND.
2 V
OUTA
Analog Output Channel A Analog Output Voltage.
3 V
OUTB
Analog Output Channel B Analog Output Voltage.
4 V
OUTC
Analog Output Channel C Analog Output Voltage.
5 V
OUTD
Analog Output Channel D Analog Output Voltage.
6 GND Ground Ground reference for all on-chip circuitry.
Unbuffered reference voltage shared by all channels. Must be decoupled
7 V
REFIN
Analog Input
to GND.
Serial Data Input. Data is clocked into the 16-bit shift register on the
8 D
IN
Digital Input
falling edges of SCLK after the fall of SYNC.
Frame synchronization input for the data input. When this pin goes low, it
enables the input shift register and data is transferred on the falling edges
9 SYNC Digital Input of SCLK. The DAC is updated on the 16th clock cycle unless SYNC is
brought high before the 16th clock, in which case the rising edge of
SYNC acts as an interrupt and the write sequence is ignored by the DAC.
Serial Clock Input. Data is clocked into the input shift register on the
10 SCLK Digital Input
falling edges of this pin.
Exposed die attach pad can be connected to ground or left floating.
PAD
11 Ground Soldering the pad to the PCB offers optimal thermal performance and
(SON only)
enhances package self-alignment during reflow.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)(3)
Supply Voltage, V
A
6.5V
Voltage on any Input Pin 0.3V to 6.5V
Input Current at Any Pin
(4)
10 mA
Package Input Current
(4)
20 mA
Power Consumption at T
A
= 25°C See
(5)
ESD Susceptibility
(6)
Human Body Model 2500V
Machine Model 250V
Junction Temperature +150°C
Storage Temperature 65°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating
Ratings is not recommended.
(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) When the input voltage at any pin exceeds 5.5V or is less than GND, the current at that pin should be limited to 10 mA. The 20 mA
maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10
mA to two.
(5) The absolute maximum junction temperature (T
J
max) for this device is 150°C. The maximum allowable power dissipation is dictated by
T
J
max, the junction-to-ambient thermal resistance (θ
JA
), and the ambient temperature (T
A
), and can be calculated using the formula
P
D
MAX = (T
J
max T
A
) / θ
JA
. The values for maximum power dissipation will be reached only when the device is operated in a severe
fault condition (e.g., when input or output pins are driven beyond the operating ratings, or the power supply polarity is reversed).
(6) Human body model is 100 pF capacitor discharged through a 1.5 k resistor. Machine model is 220 pF discharged through ZERO
Ohms.
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