Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DAC-08EP NRND PDIP NFG 16 25 TBD Call TI Call TI 0 to 70 DAC0800LCN
DAC-08EP
DAC0800LCM NRND SOIC D 16 48 TBD Call TI Call TI 0 to 70 DAC0800LCM
DAC0800LCM/NOPB ACTIVE SOIC D 16 48 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM 0 to 70 DAC0800LCM
DAC0800LCMX NRND SOIC D 16 2500 TBD Call TI Call TI 0 to 70 DAC0800LCM
DAC0800LCMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM 0 to 70 DAC0800LCM
DAC0800LCN NRND PDIP NFG 16 25 TBD Call TI Call TI 0 to 70 DAC0800LCN
DAC-08EP
DAC0800LCN/NOPB ACTIVE PDIP NFG 16 25 Pb-Free
(RoHS)
SN Level-1-NA-UNLIM 0 to 70 DAC0800LCN
DAC-08EP
DAC0802LCMX NRND SOIC D 16 2500 TBD Call TI Call TI 0 to 70 DAC0802LCM
DAC0802LCMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM 0 to 70 DAC0802LCM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.