Datasheet

DAC0800, DAC0802
SNAS538C –JUNE 1999–REVISED FEBRUARY 2013 www.ti.com
Absolute Maximum Ratings
(1)
Supply Voltage (V
+
− V
−
) ±18V or 36V
Power Dissipation
(2)
500 mW
Reference Input Differential Voltage
(V14 to V15) V
−
to V
+
Reference Input Common-Mode
Range (V14, V15) V
−
to V
+
Reference Input Current 5 mA
Logic Inputs V
−
to V
−
plus 36V
Analog Current Outputs
(V
S
− = −15V) 4.25 mA
ESD Susceptibility
(3)
TBD V
Storage Temperature −65°C to +150°C
Lead Temp. (Soldering, 10 seconds)
PDIP Package (plastic) 260°C
CDIP Package (ceramic) 300°C
Surface Mount Package
Vapor Phase (60 seconds) 215°C
Infrared (15 seconds) 220°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating conditions.
(2) The maximum junction temperature of the DAC0800 and DAC0802 is 125°C. For operating at elevated temperatures, devices in the
CDIP package must be derated based on a thermal resistance of 100°C/W, junction-to-ambient, 175°C/W for the molded PDIP package
and 100°C/W for the SOIC package.
(3) Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Operating Conditions
(1)
Min Max Units
Temperature (T
A
)
DAC0800L −55 +125 °C
DAC0800LC 0 +70 °C
DAC0802LC 0 +70 °C
V
+
(V
−
) + 10 (V
−
) + 30 V
V− −15 −5 V
I
REF
(V
−
= −5V) 1 2 mA
I
REF
(V
−
= −15V) 1 4 mA
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating conditions.
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