Datasheet
CY74FCT825T
8-BIT BUS-INTERFACE REGISTER
WITH 3-STATE OUTPUTS
SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Function, Pinout, and Drive Compatible
With FCT, F Logic, and AM29825
Reduced V
OH
(Typically = 3.3 V) Version of
Equivalent FCT Functions
Edge-Rate Control Circuitry for
Significantly Improved Noise
Characteristics
I
off
Supports Partial-Power-Down Mode
Operation
Matched Rise and Fall Times
Fully Compatible With TTL Input and
Output Logic Levels
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
64-mA Output Sink Current
32-mA Output Source Current
High-Speed Parallel Register With
Positive-Edge-Triggered D-Type Flip-Flops
Buffered Common Clock-Enable (EN) and
Asynchronous-Clear (CLR
) Inputs
3-State Outputs
description
This bus-interface register is designed to eliminate the extra packages required to buffer existing registers and
provide extra data width for wider address/data paths or buses carrying parity. The CY74FCT825T is an 8-bit
buffered register with all the CY74FCT823T controls, plus multiple enables (OE
1
, OE
2
, OE
3
) to allow multiuser
control of the interface, e.g., CS
, DMA, and RD/WR. This device is ideal for use as an output port requiring high
I
OL
/I
OH
.
This device is designed for high-capacitance load drive capability, while providing low-capacitance bus loading
at both inputs and outputs. Outputs are designed for low-capacitance bus loading in the high-impedance state.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
†
SPEED
(ns)
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
–40°C to 85°C QSOP – Q Tape and reel 6 CY74FCT825CTQCT FCT825C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Copyright 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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2
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4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
OE
1
OE
2
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
CLR
GND
V
CC
OE
3
Y
0
Y
1
Y
2
Y
3
Y
4
Y
5
Y
6
Y
7
EN
CP
Q PACKAGE
(TOP VIEW)