Datasheet

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

CY74FCT646ATSOCG4 ACTIVE SOIC DW 24 25 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT646A

CY74FCT646ATSOCT ACTIVE SOIC DW 24 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT646A

CY74FCT646ATSOCTE4 ACTIVE SOIC DW 24 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT646A

CY74FCT646ATSOCTG4 ACTIVE SOIC DW 24 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT646A

CY74FCT646CTQCT ACTIVE SSOP DBQ 24 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT646C

CY74FCT646CTQCTE4 ACTIVE SSOP DBQ 24 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT646C

CY74FCT646CTQCTG4 ACTIVE SSOP DBQ 24 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT646C

CY74FCT646CTSOC ACTIVE SOIC DW 24 25 Green (RoHS

& no Sb/Br)