Datasheet
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CY74FCT374ATQCT SSOP DBQ 20 2500 367.0 367.0 38.0
CY74FCT374ATSOCT SOIC DW 20 2000 367.0 367.0 45.0
CY74FCT374CTQCT SSOP DBQ 20 2500 367.0 367.0 38.0
CY74FCT374TQCT SSOP DBQ 20 2500 367.0 367.0 38.0
CY74FCT374TSOCT SOIC DW 20 2000 367.0 367.0 45.0
CY74FCT574ATQCT SSOP DBQ 20 2500 367.0 367.0 38.0
CY74FCT574ATSOCT SOIC DW 20 2000 367.0 367.0 45.0
CY74FCT574CTQCT SSOP DBQ 20 2500 367.0 367.0 38.0
CY74FCT574CTSOCT SOIC DW 20 2000 367.0 367.0 45.0
CY74FCT574TQCT SSOP DBQ 20 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2