Datasheet

PACKAGE OPTION ADDENDUM

www.ti.com

31-Oct-2013

Addendum-Page 4

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

CY74FCT240TSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT240

CY74FCT240TSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT240

CY74FCT244ATPC ACTIVE PDIP N 20 20 Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type -40 to 85 CY74FCT244ATPC

CY74FCT244ATPCE4 ACTIVE PDIP N 20 20 Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type -40 to 85 CY74FCT244ATPC

CY74FCT244ATQCT ACTIVE SSOP DBQ 20 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT244A

CY74FCT244ATQCTE4 ACTIVE SSOP DBQ 20 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT244A

CY74FCT244ATQCTG4 ACTIVE SSOP DBQ 20 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT244A

CY74FCT244ATSOC ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br)