Datasheet

500 1000 1500 2000 2500 3000
0
10
20
30
40
50
OUTPUT CAPACITANCE (pFd)
RISE TIME (ps)
CLC007
SNLS016E –JULY 1998–REVISED APRIL 2013 www.ti.com
Output Rise And Fall Times
Output load capacitance can significantly affect output rise and fall times. The effect of load capacitance, stray or
otherwise, may be reduced by placing the output back-match resistor close to the output pin and by minimizing
all interconnecting trace lengths. Figure 10 shows the effect on risetime of parallel load capacitance across a
150Ω load.
Figure 10. Rise Time vs C
L
PCB Layout Recommendations
Printed circuit board layout affects the performance of the CLC007. The following guidelines will aid in achieving
satisfactory device performance.
• Use a ground plane or power/ground plane sandwich design for optimum performance.
• Bypass device power with a 0.01 µF monolithic ceramic capacitor in parallel with a 6.8 µF tantalum
electrolytic capacitor located no more than 0.1” (2.5 mm) from the device power pins.
• Provide short, symmetrical ground return paths for:
– Inputs,
– Supply bypass capacitors and
– The output load.
• Provide short, grounded guard traces located
– Under the centerline of the package,
– 0.1” (2.5 mm) from the package pins
– On both top and bottom of the board with connecting vias.
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