Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- DEVICE INFORMATION
- ABSOLUTE MAXIMUM RATINGS
- THERMAL RESISTANCE FOR TSSOP (PW) PACKAGE
- RECOMMENDED OPERATING CONDITIONS
- RECOMMENDED CRYSTAL/VCXO SPECIFICATIONS
- EEPROM SPECIFICATION
- TIMING REQUIREMENTS
- DEVICE CHARACTERISTICS
- DEVICE CHARACTERISTICS (Continued)
- DEVICE CHARACTERISTICS (Continued)
- PARAMETER MEASUREMENT INFORMATION
- TYPICAL CHARACTERISTICS
- APPLICATION INFORMATION
- Control Terminal Configuration
- DEFAULT DEVICE SETTING
- SDA/SCL SERIAL INTERFACE
- DATA PROTOCOL
- Generic Programming Sequence
- Byte Write Programming Sequence
- Byte Read Programming Sequence
- Block Write Programming Sequence
- Block Read Programming Sequence
- Timing Diagram for the SDA/SCL Serial Control Interface
- SDA/SCL Hardware Interface
- SDA/SCL CONFIGURATION REGISTERS
- PLL MULTIPLIER/DIVIDER DEFINITIONPLL settings limits: 16≤q≤63, 0≤p≤7, 0≤r≤511 to PLL Multiplier/Divider Definition Section
- Revision History
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
CDCE949PWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
CDCEL949PWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Nov-2013
Pack Materials-Page 1