Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC137PWR TSSOP PW 16 2000 367.0 367.0 35.0
CD74HC137PWT TSSOP PW 16 250 367.0 367.0 35.0
CD74HC237M96 SOIC D 16 2500 333.2 345.9 28.6
CD74HC237NSR SO NS 16 2000 367.0 367.0 38.0
CD74HC237PWR TSSOP PW 16 2000 367.0 367.0 35.0
CD74HC237PWT TSSOP PW 16 250 367.0 367.0 35.0
CD74HCT137M96 SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2