Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC147M96 SOIC D 16 2500 333.2 345.9 28.6
CD74HC147PWR TSSOP PW 16 2000 346.0 346.0 29.0
CD74HC147PWT TSSOP PW 16 250 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2011
Pack Materials-Page 2