Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC688M96 SOIC DW 20 2000 367.0 367.0 45.0
CD74HC688NSR SO NS 20 2000 367.0 367.0 45.0
CD74HC688PWR TSSOP PW 20 2000 367.0 367.0 38.0
CD74HC688PWT TSSOP PW 20 250 367.0 367.0 38.0
CD74HCT688M96 SOIC DW 20 2000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2