Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC4094M96 SOIC D 16 2500 364.0 364.0 27.0
CD74HC4094M96G3 SOIC D 16 2500 364.0 364.0 27.0
CD74HC4094M96G4 SOIC D 16 2500 333.2 345.9 28.6
CD74HC4094NSR SO NS 16 2000 367.0 367.0 38.0
CD74HC4094PWR TSSOP PW 16 2000 364.0 364.0 27.0
CD74HC4094PWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
CD74HC4094PWT TSSOP PW 16 250 367.0 367.0 35.0
CD74HCT4094M96 SOIC D 16 2500 364.0 364.0 27.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Oct-2013
Pack Materials-Page 2