Datasheet

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC4052PWT TSSOP PW 16 250 367.0 367.0 35.0
CD74HC4053M96 SOIC D 16 2500 364.0 364.0 27.0
CD74HC4053M96G3 SOIC D 16 2500 364.0 364.0 27.0
CD74HC4053M96G4 SOIC D 16 2500 333.2 345.9 28.6
CD74HC4053PWR TSSOP PW 16 2000 364.0 364.0 27.0
CD74HC4053PWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
CD74HC4053PWT TSSOP PW 16 250 367.0 367.0 35.0
CD74HCT4051M96 SOIC D 16 2500 333.2 345.9 28.6
CD74HCT4052M96 SOIC D 16 2500 333.2 345.9 28.6
CD74HCT4053M96 SOIC D 16 2500 333.2 345.9 28.6
CD74HCT4053PWR TSSOP PW 16 2000 364.0 364.0 27.0
CD74HCT4053PWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
CD74HCT4053PWT TSSOP PW 16 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Oct-2013
Pack Materials-Page 3