Datasheet
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8974201RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8974201RA
CD54HCT574F3A
CD54HC374F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8407101RA
CD54HC374F3A
CD54HC574F ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 CD54HC574F
CD54HC574F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 CD54HC574F3A
CD54HCT374F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8550701RA
CD54HCT374F3A
CD54HCT574F ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 CD54HCT574F
CD54HCT574F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8974201RA
CD54HCT574F3A
CD74HC374E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC374E
CD74HC374EE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC374E
CD74HC374M ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC374M
CD74HC374M96 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC374M
CD74HC374M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC374M
CD74HC374M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC374M
CD74HC374ME4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC374M
CD74HC374MG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC374M
CD74HC574E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC574E
CD74HC574EE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC574E