Datasheet

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

CD74HC574M ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC574M

CD74HC574M96 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC574M

CD74HC574M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC574M

CD74HC574M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC574M

CD74HC574ME4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC574M

CD74HC574MG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC574M

CD74HCT374E ACTIVE PDIP N 20 20 Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT374E

CD74HCT374EE4 ACTIVE PDIP N 20 20 Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT374E

CD74HCT374M ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br)