*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC273M96 SOIC DW 20 2000 367.0 367.0 45.0
CD74HCT273M96 SOIC DW 20 2000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
