Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8985201EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8985201EA
CD54HCT259F3A
CD54HC259F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8551901EA
CD54HC259F3A
CD54HCT259F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8985201EA
CD54HCT259F3A
CD74HC259E ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC259E
CD74HC259EE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC259E
CD74HC259M ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC259M
CD74HC259M96 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC259M
CD74HC259M96E4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC259M
CD74HC259M96G4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC259M
CD74HC259ME4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC259M
CD74HC259MG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC259M
CD74HC259MT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC259M
CD74HC259MTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC259M
CD74HC259MTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC259M
CD74HCT259E ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT259E
CD74HCT259EE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT259E
CD74HCT259M ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT259M