Datasheet

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
CD54HC245F ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
CD54HC245F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
CD54HCT245F ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
CD54HCT245F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
CD74HC245E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74HC245EE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74HC245M ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD74HC245M96 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD74HC245M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD74HC245M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD74HC245ME4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD74HC245MG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD74HCT245E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74HCT245EE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74HCT245M ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD74HCT245M96 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD74HCT245M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD74HCT245M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD74HCT245ME4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD74HCT245MG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 1