Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8970401CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8970401CA
CD54HCT164F3A
CD54HC164F ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD54HC164F
CD54HC164F3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8416201CA
CD54HC164F3A
CD54HCT164F3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8970401CA
CD54HCT164F3A
CD74HC164E ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC164E
CD74HC164EE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC164E
CD74HC164M ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC164M
CD74HC164M96 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC164M
CD74HC164M96E4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC164M
CD74HC164M96G4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC164M
CD74HC164ME4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC164M
CD74HC164MG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC164M
CD74HC164MT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC164M
CD74HC164MTE4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC164M
CD74HC164MTG4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC164M
CD74HCT164E ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT164E
CD74HCT164EE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT164E