Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC123M96 SOIC D 16 2500 364.0 364.0 27.0
CD74HC123M96 SOIC D 16 2500 333.2 345.9 28.6
CD74HC123M96G4 SOIC D 16 2500 333.2 345.9 28.6
CD74HC123NSR SO NS 16 2000 367.0 367.0 38.0
CD74HC123PWR TSSOP PW 16 2000 364.0 364.0 27.0
CD74HC123PWR TSSOP PW 16 2000 367.0 367.0 35.0
CD74HC123PWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
CD74HC123PWT TSSOP PW 16 250 367.0 367.0 35.0
CD74HC423M96 SOIC D 16 2500 333.2 345.9 28.6
CD74HCT123M96 SOIC D 16 2500 333.2 345.9 28.6
CD74HCT423M96 SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Mar-2016
Pack Materials-Page 2