Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC123M96 SOIC D 16 2500 364.0 364.0 27.0
CD74HC123M96G4 SOIC D 16 2500 333.2 345.9 28.6
CD74HC123NSR SO NS 16 2000 367.0 367.0 38.0
CD74HC123PWR TSSOP PW 16 2000 367.0 367.0 35.0
CD74HC123PWT TSSOP PW 16 250 367.0 367.0 35.0
CD74HC423M96 SOIC D 16 2500 333.2 345.9 28.6
CD74HCT123M96 SOIC D 16 2500 333.2 345.9 28.6
CD74HCT423M96 SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Oct-2013
Pack Materials-Page 2