Datasheet
CD74FCT273
BiCMOS OCTAL D-TYPE FLIP-FLOP
WITH RESET
SCBS737A – JULY 2000 – REVISED JULY 2000
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
BiCMOS Technology With Low Quiescent
Power
Buffered Inputs
Direct Clear Input
48-mA Output Sink Current
Output Voltage Swing Limited to 3.7 V
Controlled Output Edge Rates
Input/Output Isolation From V
CC
SCR Latch-Up-Resistant BiCMOS Process
and Circuit Design
Applications Include:
– Buffer/Storage Registers
– Shift Registers
– Pattern Generators
Package Options Include Plastic
Small-Outline (M) Package and Standard
Plastic (E) DIP
description
The CD74FCT273 is a positive-edge-triggered, D-type flip-flop with a direct clear (CLR) input. This device uses
a small-geometry BiCMOS technology. The output stage is a combination of bipolar and CMOS transistors that
limits the output high level to two diode drops below V
CC
. This resultant lowering of output swing (0 V to 3.7 V)
reduces power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes V
CC
bounce and
ground bounce and their effects during simultaneous output switching. The output configuration also enhances
switching speed and is capable of sinking 48 mA.
Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the
positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a particular voltage level and is not
directly related to the transition time of the positive-going pulse. When CLK is at either the high or low level, the
D input has no effect at the output. All eight flip-flops are controlled by a common clock (CLK) and a common
reset (CLR
). The outputs are placed in a low state when CLR is taken low, independent of the CLK.
The CD74FCT273 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each flip-flop)
INPUTS
OUTPUT
CLR
CLK D
OUTPUT
Q
L X X L
H ↑ HH
H ↑ LL
H L X Q
0
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
E OR M PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
CLR
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
V
CC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK