Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
CD54AC245F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 CD54AC245F3A
CD54ACT245F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 CD54ACT245F3A
CD74AC245E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74AC245E
CD74AC245EE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74AC245E
CD74AC245M ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC245M
CD74AC245M96 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC245M
CD74AC245M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC245M
CD74AC245M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC245M
CD74AC245ME4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC245M
CD74AC245MG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC245M
CD74AC245SM96 OBSOLETE SSOP DB 20 TBD Call TI Call TI -55 to 125 AC245SM
CD74AC245SM96E4 ACTIVE SSOP DB 20 TBD Call TI Call TI -55 to 125
CD74AC245SM96G4 OBSOLETE SSOP DB 20 TBD Call TI Call TI -55 to 125
CD74ACT245E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74ACT245E
CD74ACT245EE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD74ACT245E
CD74ACT245M ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 ACT245M
CD74ACT245M96 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 ACT245M
CD74ACT245M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 ACT245M