Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
CD4508BD3 ACTIVE CDIP SB JD 24 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 CD4508BD/3
CD4508BE ACTIVE PDIP N 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD4508BE
CD4508BEE4 ACTIVE PDIP N 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD4508BE
CD4508BF3A ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4508BF3A
CD4508BM ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508BM
CD4508BM96 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508BM
CD4508BM96E4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508BM
CD4508BM96G4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508BM
CD4508BME4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508BM
CD4508BMG4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508BM
CD4508BNSR ACTIVE SO NS 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508B
CD4508BNSRE4 ACTIVE SO NS 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508B
CD4508BNSRG4 ACTIVE SO NS 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508B
CD4508BPW ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM508B
CD4508BPWE4 ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM508B
CD4508BPWG4 ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM508B
CD4508BPWR ACTIVE TSSOP PW 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM508B