Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
CD4067BE ACTIVE PDIP N 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD4067BE
CD4067BEE4 ACTIVE PDIP N 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD4067BE
CD4067BF ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4067BF
CD4067BF3A ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4067BF3A
CD4067BM ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BM96 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BM96E4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BM96G4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BME4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BMG4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BPW ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM067B
CD4067BPWE4 ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM067B
CD4067BPWG4 ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM067B
CD4097BE ACTIVE PDIP N 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD4097BE
CD4097BEE4 ACTIVE PDIP N 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -55 to 125 CD4097BE
CD4097BF ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4097BF
CD4097BM ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4097BM