Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4071BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4071BNSR SO NS 14 2000 346.0 346.0 33.0
CD4071BPWR TSSOP PW 14 2000 346.0 346.0 29.0
CD4072BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4072BNSR SO NS 14 2000 346.0 346.0 33.0
CD4075BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4075BNSR SO NS 14 2000 346.0 346.0 33.0
CD4075BPWR TSSOP PW 14 2000 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
Pack Materials-Page 2