Datasheet

7-1399
CD40175BMS
FIGURE 8. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF CLOCK FREQUENCY
Chip Dimensions and Pad Layout
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10
-3
inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
Electrical Performance Characteristics (Continued)
AMBIENT TEMPERATURE (T
A
) = +25
o
C
SUPPLY VOLTAGE (VDD) = 15V
10V
5V
CL = 50pF
CL = 15pF
1
8642
10
CLOCK INPUT FREQUENCY (fCL) (kHz)
10
3
10
4
10
2
864286428642
8
6
4
10
5
2
8
6
4
10
4
2
8
6
4
10
3
2
8
6
4
10
2
2
10
POWER DISSIPATION PER FLIP-FLOP (PD) (µW)