User's Manual



1.1 GeneralFeatures
TheLAUNCHCC3220MODASFSimpleLinkLaunchPadincludesthefollowingfeatures:

CC3220MODASF, SimpleLink Wi-Fi, internet-on-a-chip solution with integrated MCU 

40-pin LaunchPad standard that leverages the BoosterPack ecosystem 

TI Standard XDS110 based JTAG emulation with serial port for Flash programming. 

Supports both 4-wire JTAG and 2-wire SWD 

Two buttons and three LEDs for user interaction 

Virtual COM port UART through USB on PC 

On-board chip antenna with U.FL for conducted testing selectable using 0 Ohm resistors. 

On-board accelerometer and temperature sensor for out-of-box demo with option to isolate them
from the inter-integrated circuit (I2C) bus


Micro USB connector for power and debug connections 

Headers for current measurement and external JTAG connection. Option to use the on-board
XDS110 to debug customer platforms.


Bus-powered device with no external power required for Wi-Fi 

Long range transmission with highly optimized antenna (200m typical in open air using an Access
point with 6dBi antenna AP)


Can be powered externally, with 2xAA or 2xAAA alkaline batteries working down to 2.3V typical
(typ)

 Four‐layerPCB
 Dimensions:103.1mm(L)x58.42(W)

1.2 KeyBenefits
TheCC3220MODxandCC3220MODASxmodulesofferthefollowingbenefits:
 CC3220MODSandCC3220MODASareWi‐Fi®ModulesthatConsistoftheCC3220SM2ARGK
WhiletheCC3220MODSFandtheCC3220MODASFConsistoftheCC3220SF12ARGKSingle‐Chip
MCUs,respectively.
The Fully Integrated, Industrial Temperature Grade, Green Modules Include
all Required Clocks, SPI Flash, and Passives.

 TheCC3220MODAxModulesIncludeanIntegralAntennaforEasyIntegrationIntotheHost
System.

CC3220MODx and CC3220MODAx SimpleLink™ Wi-Fi Wireless Microcontroller Unit (MCU)
System-on-Chip (SoC) is a Single-Chip With Two Separate Execution Environments:

o
User Application Dedicated ARM ® Cortex ® -M4 MCU 
o
Network Processor MCU to Run All Wi-Fi and Internet Logical Layers 

FCC, IC, CE, MIC, and SRRC Certified 

Wi-Fi CERTIFIED™ Modules, Can Request Certificate Transfer for Wi-Fi Alliance Members 

1.27-mm Pitch LGA Package for Easy Assembly and Low-Cost PCB Design 

Applications MCU Subsystem 
o
ARM Cortex-M4 Core at 80 MHz 
o
Embedded Memory 