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BOOSTXL‐CC3120MODSimpleLink™

BoosterPack™Plug‐inModuleandIoTSolution

TheCC3120MODRNMMOB(CC3120MOD)moduleispartoftheSimpleLink™microcontroller(MCU)

platformthatsharesacommon,easy‐to‐usedevelopmentenvironmentwithasinglecoresoftware

developmentkit(SDK)andrichtoolset.Aone‐timeintegrationoftheSimpleLinkplatformle tsyouadd

anycombinationofdevicesfromtheportfolio

intoyourdesign.Th eultimategoaloftheSimpleLink

platformistoachieve100percentcodereusewhenyourdesignrequirementschange.Formore

information,visitwww.ti.com/simplelink.

TheBOOSTXL‐CC3120MODisa2.4GHzWi‐Fi®SimpleLink™BoosterPack™withtheTICC3120MOD

module.TheCC3120MODisFCC,IC,CE,MIC,andSRRCcertified.Thepurposeofthisdocumentisto

providetheendintegratorwiththeinformationnecessarytoincorporatetheCC3120MODmoduleinto

theirfinalproduct.It

alsoprovidedinformationhowtoruntheBOOSTXL‐CC3120MODSimpleLink

BoosterPacktoevaluatetheCC3120MODmodule.

Contents

1. Overview...............................................................................................................................................3

1.1 GeneralFeatures...........................................................................................................................7

1.2 KeyBenefits..................................................................................................................................8

1.3 KeyBenefits................................................................................................................................10

2. ConnectorsandJumpers.............................................................................................................10

2.1 ConnectorsandJumpers.............................................................................................................11

2.2 JumperSettings...........................................................................................................................12

2.3 2x20Pinconnectorassignment..................................................................................................12

3. Elec tricalCharacteristics.....................................................................................................................13

4.

AntennaCharacteristics......................................................................................................................13

5. CircuitDesign......................................................................................................................................13

5.1 CC3120MODReferenceschematic.............................................................................................13

5.2 BillofMaterials(BOM)........................................................................................................................14

6. LayoutGuidelines................................................................................................................................15

6.1 BoardLayout...............................................................................................................................15

6.2 GeneralLayoutRecommendations.............................................................................................16

6.3 RFLayoutRecommendations.....................................................................................................17

6.4 AntennaPlacementandRouting................................................................................................

18

6.5 TransmissionLineConsiderations...............................................................................................18

7. BOOSTXL‐CC3120MODOperationalSetupandTesting.....................................................................19

7.1 Power..........................................................................................................................................20

7.1.1 PowerfromtheLaunchPadkitortheCC31XXEMUBOOST........................................................20

7.1.2 OnboardLDOPower...................................................................................................................22

7.2 MeasuringtheCC3120MODCurrentDraw................................................................................22

7.2.1 Low‐CurrentMeasurements(Hibernate

andLPDS)...................................................................22

7.2.2 ActiveCurrentMeasurements....................................................................................................23

7.3 Clocking.......................................................................................................................................24

Summary of content (37 pages)

PAGE 1
BOOSTXL‐CC3120MOD SimpleLink™ BoosterPack™ Plug‐in Module and IoT Solution The CC3120MODRNMMOB (CC3120MOD) module is part of the SimpleLink™ microcontroller (MCU) platform that shares a common, easy‐to‐use development environment with a single core software development kit (SDK) and rich tool set. A one‐time integration of the SimpleLink platform lets you add any combination of devices from the portfolio into your design.
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7.4 Performing Conducted Tests ...................................................................................................... 24 7.5 Connecting to PC Using the CC31XXEMUBOOST ........................................................................ 25 7.5.1 CC31XXEMUBOOST ..................................................................................................................... 25 7.5.1.1 Overview ..............................................................................................
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1. Overview Figure 1‐1 shows a functional block diagram of the CC3120MOD module. CC3X20 40Mhz 32.768 kHz RF_ANT1 UART nReset MAC/PHY SPI BGN WRF F HIB 2.3 – 3.
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CC3120MODRNMMOB Figure 1‐2: Functional block diagram of the BOOSTXL‐CC3120MOD Figure 1‐3 shows the hardware implementation of the BOOSTXL‐CC3120MOD
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Figure 1‐3: Hardware implementation of the BOOSTXL‐CC3120MOD Figure 1‐4 shows the Top Overlay of the BOOSTXL‐CC3210MOD SimpleLink BoosterPack.
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Figure 1‐4: BOOSTXL‐CC3120MOD Top Overlay Figure 1‐5 shows the Top Solder of the BOOSTXL‐CC3210MOD SimpleLink BoosterPack.
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Figure 1‐5: BOOSTXL‐CC3120MOD Top Solder 1.1 General Features The BOOSTXL‐CC3120MOD SimpleLink BoostPack includes the following features:          Two 20‐pin stackable connectors compatible with the TI SimpleLink Launchpad™ and BoosterPack architecture. Built‐in chip antenna Optional U.FL connector for external antennas or conducted based testing. Power from an onboard LDO by using the USB or 3.
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 1.2 Dimensions: 58.52 mm (L) x 43.18 (W) Key Benefits The CC3120MOD module offers the following benefits:            The CC3120MOD (CC3120MODRNMMOB) is a Wi‐Fi® Module Which Includes the CC3120RNMARGK Wi‐Fi Network Processor (NWP). The Fully Integrated, Industrial Temperature Grade, Green Module, Includes All Required Clocks, Serial Peripheral Interface (SPI) Flash, and Passives.
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           Secure Key Storage  File System Security  Software Tamper Detection  Cloning Protection Embedded Network Applications Running on a Dedicated NWP o HTTP/HTTPS Web Server With Dynamic User Callbacks o mDNS, DNS‐SD, DHCP Server o Ping Recovery Mechanism – Ability to Recover to Factory Defaults Wi‐Fi TX Power o 17 dBm at 1 DSSS o 16.5 dBm at MCS0 Wi‐Fi RX Sensitivity o –95 dBm at 1 DSSS o –73.
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1.3 Key Benefits The CC3120MOD module is designed for the following internet of Things (IoT) applications, including:              2.
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Figure 2‐2: BOOSTXL‐CC3120MOD Bottom View 2.1 Connectors and Jumpers Table 2‐1 lists the push‐buttons on the BOOSTXL‐CC3120MOD Reference Usage Comments SW1 Factory Reset This is used to restore the serial flash to the factory default image. Hold the button pressed and then toggle the RESET push button. SW2 RESET This can be used to Reset the device. Holding the button down sets the device to the shutdown state.
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2.2 Jumper Settings Table 2‐3 lists the jumper settings on the BOOSTXL‐CC3120MD Reference Usage Comments J7 USB connector J8 Power selection J6 Current measurement For Hibernate and LPDS currents, connect an ammeter across J6 : Range (< 500 µA) For Active current, mount a 0.1 Ω resistor on R35 and measure the voltage across the 0.1 Ω resistor using a voltmeter (range (< 50 mV peak-peak)). P1, P2, P3, P4 BoosterPack header 2x10 pins each connected to the LaunchPad. J3 LED EN.
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Table 2‐5 lists the inner row connectors of the two 20‐pin headers. Pin No Signal Name Direction Pin No Signal Name Direction P3.1 +5 V IN P4.1 UNUSED OUT P3.2 GND IN P4.2 UNUSED OUT P3.3 UNUSED NA P4.3 UNUSED NA P3.4 UNUSED NA P4.4 UART1_CTS IN P3.5 UNUSED NA P4.5 UART1_RTS OUT P3.6 UNUSED NA P4.6 UNUSED NA P3.7 UNUSED NA P4.7 NWP_LOG_TX OUT P3.8 UNUSED NA P4.8 WLAN_LOG_TX OUT P3.9 UNUSED NA P4.9 UNUSED IN P3.10 UNUSED NA P4.
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Figure 5‐1: CC3120MOD Engine area reference schematic 5.2 Bill of Materials (BOM) The CC3120MOD main engine area reference BOM is show in Table 5‐1 below. The full BOOSTXL‐ CC3120MOD reference BOM can be found at: http://www.ti.com/lit/zip/swrc339.
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6. Layout Guidelines The integrator of the CC3120MOD module must comply with the PCB layout recommendations described in the following subsections to preserve/minimize the risk with regulatory certifications for FCC, IC, CE, MIC, and SRRC. Moreover, TI recommends customers follow the guidelines described in this section to achieve similar performance. 6.1 Board Layout The reference layout consists of a 2 layer design. Figure 6‐1 shows BOOSTXL‐CC3120MOD Top layer.
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Figure 6‐2: BOOSTXL‐CC3120MOD Bottom Layer 6.2 General Layout Recommendations Ensure that the following general layout recommendations are followed:         Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. Do not run signal traces underneath the module on a layer where the module is mounted. RF traces must have 50-Ω impedance. RF trace bends must be made with gradual curves, and 90 degree bends must be avoided.
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6.3 RF Layout Recommendations The RF section of this wireless device gets top priority in terms of layout. It is very important for the RF section to be laid out correctly to ensure optimum performance from the device. A poor layout can cause low‐output power, EVM degradation, sensitivity degradation, and mask violations. Figure 6‐3 shows the RF placement and routing of the CC3120MOD module.
PAGE 18
6.4 Antenna Placement and Routing The antenna is the element used to convert the guided waves on the PCB traces to the free space electromagnetic radiation. The placement and layout of the antenna are the keys to increased range and data rates. Table 6‐2 provides a summary of the antenna guidelines. Item 1 2 3 4 5 6 7 8 6.5 Guidelines Place the antenna on an edge or corner of the PCB. Ensure that no signals are routed across the antenna elements on all the layers of the PCB.
PAGE 19
Figure 6‐6 shows the top view of the coplanar waveguide with GND and via stitching. Figure 6‐6: CPW with GND and via stitching (Top view) The recommended values for the PCB are provided for 2‐layer boards it Table 6‐3 and 4‐layer boards in Table 6‐4. Table 6‐3: Recommended PCB Values for 2‐Layer Board (L1 to L2 =42.1 mils) Table 6‐4: Recommended PCB Values for 4‐layer Board (L1 to L2 = 16 mils) 7.
PAGE 20
BoosterPack™ plug‐in module. This Internet‐on‐a chip™ solution contains all that is needed to easily create Internet‐of‐things solutions – enhanced security features, quick connection establishment, cloud support and more. The CC3120MOD module BoosterPack can be used in several ways. It can be connected to a Texas Instruments™ MCU Launchpad™ development kit (software examples provided for MSP‐EXP430F5529LP). It can also be plugged into a CC31XXEMUBOOST board and connected to a PC for MCU emulation.
PAGE 21
example, the LaunchPad kit with only 20 pins), the USB connector on the BOOSTXL‐CC3120MOD should be used to provide the LDO input as shown in Figure 7‐1. Figure 7‐1: 3.
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7.1.2 Onboard LDO Power On some LaunchPad kits, the 3.3 V is not capable of sourcing the 350‐mA peak current required for the BOOSTXL‐CC3120MOD module. If the 350‐mA peak current cannot be sourced, the onboard 3.3‐V LDO can be used (see Figure 7‐3). This LDO must be sourced from the USB connector on the BOOSTXL‐ CC3120MOD and the LaunchPad kit in a shared‐load manner. Figure 7‐3: 3‐3‐V Power From LDO 7.2 7.2.
PAGE 23
Figure 7‐4: Low‐Current Measurement 7.2.2 Active Current Measurements To measure active current in a profile form, it is recommended to use a 0.1‐Ω, 1% resistor on the board and measure the differential voltage across it (see Figure 7‐4). This can be done using a voltmeter or an oscilloscope for measuring the current profile.
PAGE 24
Figure 7‐4: Active Current Measurement 7.3 Clocking All of the required clocks are inside the module. There is no need to supply any external clock. 7.4 Performing Conducted Tests The BoosterPack board by default ships with the RF signal connected to the onboard chip antenna. Figure 7‐5 shows that there is a U.FL connector on the board that can be used for conducting testing or to connect an external antenna. This requires a board modification (mounting C4 and depopulating C5) as shown in Figure 7‐5.
PAGE 25
Figure 7‐5: U.FL Connector 7.5 Connecting to PC Using the CC31XXEMUBOOST 7.5.1 CC31XXEMUBOOST 7.5.1.1 Overview The CC31XXEMUBOOST is designed to connect the BoosterPack module to a PC using a USB connection. This updates the firmware patches, which are stored in the serial flash, on the BoosterPack; and in software development using SimpleLink Studio. The board is also used for measuring the RF performance using a software tool named RadioTool. 7.5.1.
PAGE 26
Figure 7‐6: CC31XXEMUBOOST board The board has two FTDI ICs to enumerate multiple COM and D2XX ports. The details of the ports are given in Table 7‐1 below. Port Number Port Type 1 D2XX SPI port for SL Studio 2 D2XX GPIO for SL Studio 3 VCP COM port for Flash programming 4 VCP NWP Usage Comments Control the nRESET, nHIB, IRQ Network processor logger output. Used with specific tools to analyze the network processor logs. For TI use only.
PAGE 27
Figure 7‐7: COM port list Table 7‐2 lists the available ports on J5. Port Number Port Type 1 2 Usage Comments VCP RT3 Used for TI internal debug only. VCP MAC logger Used for TI internal debug only. Table7‐2: Ports on J5 7.5.1.3 Driver Requirements The FTDI Debug board requires you to install the associated drivers on a PC. This package is available as part of the SDK release and is located at: [Install-Path]\CC3120sdk\tools\cc31xx_board_drivers\. The install path is usually C:\ti\CC3120SDK.
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Figure 7‐8: BOOSTXL‐CC3120MOD Connected to CC31XXEMUBOOST CAUTION Align pin 1 of the boards together using the triangle marking on the PCB. An incorrect connection can permanently destroy the boards. Ensure that none of the header pins are bent before connecting the boards. 7.5.
PAGE 29
7.5.4 CC31XXEMUBOOST Jumper Settings Table 7‐4 specifies the jumpers to be installed while pairing with the FTDI board. Note that jumpers not listed in Table 7‐4 remain open. No Jumper Settings Notes 1 J4 (short) Provide 3.3 V to the BoosterPack 2 J22 (short) Provide 5.0 V to the BoosterPack 3 J3 (1-2) Route the NWP logs to the Dual port also Table 7‐4: CC31XXEMUBOOST Jumper Settings 7.5.
PAGE 30
separately. For this, a USB connector is provided on the BoosterPack module to provide the 3.3 V separately. The power supply jumpers should be configured as shown in Figure 7‐9 when the power is supplied from the on‐board USB connector. Connect USB Figure 7‐9: Jumper Configuration when working with Launchpad kit NOTE: Since there are two power sources in this setup, it is important to follow the power‐up sequence. Always power the BoosterPack module before powering the LaunchPad kit.
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Manual Information to the End User The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual must include all required regulatory information/warning as shown in this manual. 1. RF Function and Frequency Range The CC3120MODRNMMOB is design to operate in the WLAN 2.4GHz band.
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2.1 FCC The TI CC3120MOD module is certified for FCC as a single‐modular transmitter. The module is an FCC‐ certified radio module that carries a modular grant. You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:   This device may not cause harmful interference.
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Operation is subject to the following two conditions:   This device may not cause interference. This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
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 Contains IC: 451I‐CC3120MOD This module is designed to comply with the JP statement, 201‐170387. The host system using this module must display a visible label indicating the following text:  2.
PAGE 35
distances for compliance for the intended use and installation of the device based on evaluation of either specific absorption rate (SAR), field strength, or power density, whichever is most appropriate. 2.6 Simultaneous Transmission Evaluation This module has not been evaluated or approved for simultaneous transmission as it is impossible to determine the exact multi‐transmission scenario that a host manufacturer may choose.
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3.3 Waste Electrical and Electronic Equipment (WEEE) Waste Electrical and Electronic Equipment (WEEE) This symbol means that according to local laws and regulations your product and/or battery shall be disposed of separately from household waste. When this product reaches its end of life, take it to a collection point designated by local authorities. Proper recycling of your product will protect human health and the environment. 3.
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2. If any other simultaneous transmission radio is installed in the host platform together with this module, or above restrictions cannot be kept, a separate RF exposure assessment and CE equipment certification is required.